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內(nèi)容簡介
FEATURES
?Very low profile - typical height of 1.0 mm
?Ideal for automated placement
?Glass passivated chip junction
?Low forward voltage drop
?Low thermal resistance
?Meets MSL level 1, per J-STD-020, LF maximum
peak of 260 °C
?AEC-Q101 qualified
?Compliant to RoHS directive 2002/95/EC and in
accordance to WEEE 2002/96/EC
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